基片类型和规格 Substrate Types / 基片类型 “A” Surface (CLA) “B” Surface (CLA) Asfired Alumina (Al2O3) 99.6% 共烧氧化铝 < 3µ" (76nm) < 4µ" (100nm) Polished Alumina Al2O3) 99.6% 抛光氧化铝 < 1.0µ" (25nm) < 1.0µ" (25nm) Aluminum Nitride (AlN) / 氮化铝 < 4.0µ" (100nm) < 4.0µ" (100nm) Beryllium Oxide (BeO) / 氧化铍 < 4.0µ" (100nm) < 4.0µ" (100nm) Fused Silica, Quartz (SiO2) / 二氧化硅、石英 60/40 optical polish 60/40 optical polish Sapphire (a/c plane-Al2O3) / 蓝宝石 < 1.0µ" (25nm) < 1.0µ" (25nm) Ferrites and Garnets / 铁氧体和石榴子石 < 16.0µ" (406nm) < 16.0µ" (406nm) Polished Titanates / 抛光钛酸盐 < 4µ" (100nm) < 4µ" (100nm) 材料厚度和公差可以根据客户要求定制. 材料规格(化学成份、纯净度、颜色、密度、表面抛光、拱曲度、厚度、厚度误差、工艺加工尺寸、温度系数、电介质、硬度等) —具体请见公司网站: www.thinfilm.com
|